protection products 1 www.semtech.com preliminary protection products - railclamp ? ? ? ? ? RCLAMP3346P low capacitance rclamp ? 6-line esd protection description features dimensions circuit diagram revision 11/12/2013 applications mechanical characteristics ? esd protection for high-speed data lines to iec 61000-4-2 (esd) 20kv (air), 17kv (contact) iec 61000-4-5 (lightning) 5a (8/20 s) iec 61000-4-4 (eft) 40a (5/50ns) ? package design optimized for high speed lines ? flow-through design ? protects six high-speed lines ? low capacitance: 0.65pf maximum (i/o to ground) ? low esd clamping voltage ? low dynamic resistance: 0.15 ohms (typ) ? qualified to aec-q100 ? solid-state silicon-avalanche technology ? sgp2708n7 7-pin package (2.7 x 0.8 x 0.50mm) ? pb-free, halogen free, rohs/weee compliant ? lead pitch: 0.4mm (intra-pair) ? lead finish: nipdau ? marking: marking code ? packaging: tape and reel 6-line protection nominal dimensions in mm (bottom view) ? usb 3.0 ? esata ? display port ? lvds pin 1 pin 3 pin 4 pin 5 pin 2 pin 6 pin 7 the rclamp ? 3346p provides esd protection for high- speed data interfaces. it features a high maximum esd withstand voltage of 17kv contact and 20kv air discharge per iec 61000-4-2. RCLAMP3346P is designed to minimize both the esd peak clamping and the tlp clamping. package inductance is reduced at each pin resulting in lower peak esd clamping voltage. the dynamic resistance is among the industry?s lowest at 0.15 ohms (typical). maximum capacitance on each line to ground is 0.65pf allowing the RCLAMP3346P to be used in applications operating in excess of 5ghz without signal attenuation. each device will protect up to six lines (three high-speed pairs). the RCLAMP3346P is in a 7-pin sgp2708n7 package measuring 2.7 x 0.8mm with a nominal height of 0.50mm. the leads have a nominal pin-to-pin pitch of 0.40mm. flow- through package design simplifies pcb layout and maintains signal integrity on high-speed lines. the combination of low peak esd clamping, low dynamic resistance, and innovative package design enables this device to provide the highest level of esd protection for applications such as usb 3.0, esata, and displayport. 2.70 0.50 0.80 0.40 bsc 0.80 bsc
2 ? 2013 semtech corporation www.semtech.com preliminary protection products RCLAMP3346P absolute maximum rating electrical characteristics (t=25 o c) g n i t a rl o b m y se u l a vs t i n u ) s 0 2 / 8 = p t ( t n e r r u c e s l u p k a e pi p p 5 . 4a ) r i a ( 2 - 4 - 0 0 0 1 6 c e i r e p d s e 1 ) t c a t n o c ( 2 - 4 - 0 0 0 1 6 c e i r e p d s e 1 v d s e 0 2 - / + 7 1 - / + v k e r u t a r e p m e t g n i t a r e p ot j 5 2 1 + o t 5 5 -c e r u t a r e p m e t e g a r o t st g t s 0 5 1 + o t 5 5 -c r e t e m a r a pl o b m y ss n o i t i d n o cm u m i n i ml a c i p y tm u m i x a ms t i n u e g a t l o v f f o - d n a t s e s r e v e rv m w r d n g o t o / i y n a3 . 3v e g a t l o v r e g g i r t 2 v g i r t s n 0 0 1 / 2 . 0 = p l t8v t n e r r u c e g a k a e l e s r e v e ri r v m w r 5 2 = t , v 3 . 3 = o c d n g o t o / i y n a 1 0 . 05 0 . 0a v m w r 5 2 1 = t , v 3 . 3 = o c d n g o t o / i y n a 0 5 1 . 0a e g a t l o v g n i p m a l cv c i p p s 0 2 / 8 = p t , a 1 = d n g o t o / i y n a 5 . 25 . 3v e g a t l o v g n i p m a l cv c i p p s 0 2 / 8 = p t , a 5 . 4 = d n g o t o / i y n a 5 . 35 . 4v e g a t l o v g n i p m a l c d s e 2 v c i p p , a 6 1 = s n 0 0 1 / 2 . 0 = p l t 5 . 5v e g a t l o v g n i p m a l c d s e 2 v c i p p , a 6 1 - = s n 0 0 1 / 2 . 0 = p l t 3v ) e v i t i s o p ( e c n a t s i s e r c i m a n y d 3 , 2 r d s n 0 0 1 / 2 . 0 = p l t5 1 . 0s m h o e c n a t s i s e r c i m a n y d ) e v i t a g e n ( 3 , 2 r d s n 0 0 1 / 2 . 0 = p l t4 1 . 0s m h o e c n a t i c a p a c n o i t c n u jc j v r , z h m 1 = f , v 0 = d n g o t o / i y n a 0 6 . 05 6 . 0f p v r , z h m 1 = f , v 0 = s n i p o / i n e e w t e b 0 3 . 04 . 0f p notes 1)measured with a 20db attenuator, 50 ohm scope input impedance, 2ghz bandwidth. esd gun return path connected to esd ground plane. 2)transmission line pulse test (tlp) settings: t p = 100ns, t r = 0.2ns, i tlp and v tlp averaging window: t 1 = 70ns to t 2 = 90ns. 3) dynamic resistance calculated from i tlp = 4a to i tlp = 16a
3 ? 2013 semtech corporation www.semtech.com preliminary protection products RCLAMP3346P typical characteristics clamping voltage vs. peak pulse current (between any i/o and ground) junction capacitance vs. reverse voltage (between any i/o and ground) esd clamping (-8kv contact per iec 61000-4-2) (between any i/o and ground) esd clamping (+8kv contact per iec 61000-4-2) (between any i/o and ground) tlp characteristic (positive) tlp characteristic (negative) -10 0 10 20 30 40 50 60 70 80 90 -10 0 10 20 30 40 50 60 70 80 time (ns) voltage (v) measured with 50 ohm scope input impedance, 2ghz bandwidth. corrected for 50 ohm, 20db attenuator. esd gun return path connected to esd ground p lane. -80 -70 -60 -50 -40 -30 -20 -10 0 10 -10 0 10 20 30 40 50 60 70 80 time (ns) voltage (v) measured with 50 ohm scope input impedance, 2ghz bandwidth. corrected for 50 ohm, 20db attenuator. esd gun return path connected to esd ground plane. 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 012345 peak pulse current - i pp (a) clamping voltage - v c (v) waveform parameters: tr = 8s td = 20s 0 5 10 15 20 25 30 0246810 tlp current (a) clamping voltage (v) transmission line pulse test (tlp) settings: t p =100ns, t r =0.2ns, i tlp and v tlp averaging window: t 1 =70ns to t 2 =90ns -30 -25 -20 -15 -10 -5 0 -10-8-6-4-2 0 tlp current (a) clamping voltage (v) transmission line pulse test (tlp) settings: t p =100ns, t r =0.2ns, i tlp and v tlp averaging window: t 1 =70ns to t 2 =90ns 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 0.00.51.01.52.02.53.03.5 capacitance - c j (pf) reverse voltage - v r (v) f = 1 mhz t=25 o c
4 ? 2013 semtech corporation www.semtech.com preliminary protection products RCLAMP3346P typical characteristics (con?t) analog crosstalk typical insertion loss s21 \ 100 \ 90 \ 80 \ 70 \ 60 \ 50 \ 40 \ 30 \ 20 \ 10 0 1.00e+07 1.00e+08 1.00e+09 1.00e+10 frequency (hz) cross talk (db) pin ? 5 ? to ? pin ? 7 pin ? 4 ? to ? pin ? 5 pin ? 1 ? to ? pin ? 7 -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 0110 frequency (ghz) insertion loss - (il) db
5 ? 2013 semtech corporation www.semtech.com preliminary protection products RCLAMP3346P applications information figure 2 - example usb 3.0 layout (type b device connector) RCLAMP3346P is designed to protect all six usb 3.0 superspeed and high speed differential lines. pcb traces enter and exit each i/o pin and ground is connected at pin 2. for best results, it is recommended that the ground connection be made using a filled via-in-pad. the via should be filled with a conductive paste. this technique saves board space and reduces parasitic inductance in the ground path. figures 2 and 3 are examples of how to route high speed differential traces through the RCLAMP3346P. differential impedance of each pair can easily be controlled for usb 3.0 (85 ohms +/-15%). the RCLAMP3346P should be placed as close to the connector as possible for optimum esd performance. internal construction of the RCLAMP3346P has been optimized to minimize series inductance within the package. this helps to reduce the esd peak clamping voltage. dynamic resistance is extremely low (typically 0.15 ohms) further reducing the esd clamping voltage. figure 1 - usb 3.0 eye diagram with RCLAMP3346P protecting usb 3.0 ports usb 3.0 - type b device connector RCLAMP3346P uclamp0541t vbus d+ d- ssrx+ ssrx- sstx+ sstx- gnd gnd usb 3.0 - type a device connector RCLAMP3346P uclamp0541t vbus d+ d- sstx+ sstx- ssrx+ ssrx- gnd gnd figure 3 - example usb 3.0 layout (type a device connector)
6 ? 2013 semtech corporation www.semtech.com preliminary protection products RCLAMP3346P assembly guidelines the small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. semtech's recommended assem- bly guidelines for mounting this device are shown in the table 1. figure 4 details semtech?s recommended aperture. note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. exact manufacturing parameters will require some experimentation to get the desired solder application. figure 4 - recommended mounting pattern applications information r e t e m a r a p y l b m e s s an o i t a d n e m m o c e r n g i s e d l i c n e t s r e d l o sd e h s i l o p - o r t c e l e , t u c r e s a l e p a h s e r u t r e p a d e d n u o r h t i w r a l u g n a t c e r s r e n r o c s s e n k c i h t l i c n e t s r e d l o s) " 4 0 0 . 0 ( m m 0 0 1 . 0 e p y t e t s a p r e d l o sr e l l a m s r o e r e h p s e z i s 4 e p y t e l i f o r p w o l f e r r e d l o s0 2 0 - d t s - j c e d e j r e p n g i s e d d a p r e d l o s b c pd e n i f e d k s a m r e d l o s - n o n h s i n i f d a p b c pu a i n r o p s o all dimensions are in mm. component land pad. stencil opening 0.200 0.700 0.025 0.200 2.700 0.800 0.350 0.025 0.400 table 1 - recommended assembly parameters
7 ? 2013 semtech corporation www.semtech.com preliminary protection products RCLAMP3346P outline drawing - so-8 outline drawing - sgp2708n7 land pattern - sgp2708n7 b bbb aaa n l d dim a1 a 0.25 0.15 0.20 0.40 0.30 0.08 0.10 7 0.35 2.70 millimeters max 0.05 0.53 dimensions min 0.00 nom 0.47 0.03 0.50 controlling dimensions are in millimeters (angles in degrees ). notes: 1. 0.80 e 2.775 2.65 0.75 0.875 pin 1 indicator (laser mark ) bbb cab seating plane c b a e 0.80 bsc d e e/2 e d/2 (0.025-0.075) lxn e/2 bxn this land pattern is for reference purposes only . consult your manufacturing group to ensure your notes: 2. company's manufacturing guidelines are met . controlling dimensions are in millimeters (angles in degrees ). 1. dim x y p millimeters 0.20 0.65 0.80 dimensions 1.25 z 0.625 p/2 p y z x
8 ? 2013 semtech corporation www.semtech.com preliminary protection products RCLAMP3346P marking code ordering information railclamp and rclamp are trademarks of semtech corporation. carrier tape specification device orientation in tape yyww = date code r e b m u n t r a p r e p y t q l e e r l e e r e z i s t n t . p 6 4 3 3 p m a l c r0 0 0 , 0 1h c n i 7 pin 1 location (towards sprocket holes ) user direction of feed yyww yyww 3346 p yyww yyww yyww yyww 3346 p 3346 p 3346 p 3346 p 3346 p pin 1 indicat or yyw w 3346p
9 ? 2013 semtech corporation www.semtech.com preliminary protection products RCLAMP3346P contact information semtech corporation protection products division 200 flynn road, camarillo, ca 93012 phone: (805)498-2111 fax (805)498-3804
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